10 Best solder of 2019

  • Type: Wire
  • Alloy: 60/40 (60% Tin, 40% Lead)
  • Description/Function: Wire Solder
  • √ Tin Lead Solder Wire: High Quality Rosin Core Solder...
  • √ Parameters: solder wire Tin 63%- Lead 37% (Sn63-Pb37)
  • √ Flux content 1.8%,electrical soldering wire dia is...
  • ★ Fine Rosin Core Solder
  • ★ Alloy: Tin 60%- Lead 40%
  • ★ Lower Melting Point: 361F/183C
  • Wire Diameter: .031"
  • Alloy: 60% Tin / 40% Lead
  • Core Size: 66 (3.3% by weight)
  • Innovative Silicone Nozzle allows closer placement to...
  • Compact design allows easy one handed operation
  • Withstands direct contact with soldering iron (350C Max)
  • Leaded Solder Paste
  • T4 new industry standard
  • 183C 361F Melting Point (Eutectic)
  • · Holds Item Securely (Leaving Hands Free) with 2 Alligator...
  • · Heavy duty cast iron base keeps unit upright and provides...
  • · Mirror and clamps are mounted on adjustable ball joints...
  • Industry standard for decades
  • Excellent solderability to a wide variety of metallization's
  • High activity rosin core formulation
  • Type: Wire
  • Alloy: 60/40 (60% Tin, 40% Lead)
  • Description/Function: Wire Solder
  • 1.Tin Lead Solder Wire: High Quality Rosin Core Solder Wire
  • 2.Sn/pb: 60%/40%; Flux: 2.2%;Diameter 1.0 mm/ 0.039 inch
  • 3.Lower Melting Point: 361F/183C. easy to be soldered, flows...

Soldering guide

Soldering is used exclusively for soldering – that means at temperatures between 60 ° Celsius and 420 ° Celsius. This is due to the low melting point, which in turn is the basic condition for low temperature soldering. Commercially available solder despite its name never exists of pure tin. It is always a prepared tin-based alloy to which other metals are added to improve its properties.

Solder has different characteristics by composition

Soldering is principally used to permanently bond various metal surfaces. In the home field, this is the most common case of electronic devices. The combination with a metal creates a stable, durable and conductive bridge that retains its main characteristics even when exposed to external corrosion. Tin serves as the starting metal due to its low melting point. It is mixed with different substances. In the past, this often included lead. It has good flow properties and can further lower the melting point. Because of the toxicity and the dangers to the environment, lead lotions are now only allowed in a few areas. This includes the private application, which is why lead silos are still found in commercial trading. Their use is, however – if possible – discouraged. Electronic products in the private, commercial trade must be soldered in any case lead-free. Common additives today are copper and bismuth. Depending on the desired material properties, the use of special solders may be required. Thus, antimony increases the tensile strength, silver or copper increase the adhesive force on corresponding lower surfaces and reduce the impairment for the carrier material.

Flux for better adhesion

The flux or flux serves to prevent the oxidation by the high temperatures by closing the body of oxygen. In addition, it increases the adhesion of the liquid solder on metal surfaces. Originally became solder used separately from a flux, which was additionally applied. This is no longer the case with newer variants for soldering electronics. The flux is already in the solder integrated. Different materials are used, which are either completely synthetic based on petroleum or based on natural principles such as rosin and tree resin. When buying, it is therefore important to pay attention to the addition of flux. This may not be desirable under certain circumstances – for example, in very small components in microelectronics or large-scale soldering of water pipes. Depending on the materials used, it may be necessary to add additional flux – aluminum workpieces, for example, can not be soldered without this.

Commercial designations for solder

According to the international standard DIN 1707 soft solders are divided into four groups. Group A includes solder with and without the addition of antimony. Group B includes those with admixtures of silver, phosphorus or copper, while D covers aluminum. Group C stands for special notes that are used in special cases. The division A is also divided into different subgroups: Ah for a medium and high proportion of antimony, Aa for a low and Af for antimony-free solder. Antimony is a common additive that increases, among other things, the tensile strength and thereby the stability of a compound. Another advantage is that unlike other metals, when it cools it expands rather than shrinks.

A disadvantage is that some shrinkage is desired in some applications, such as micro-soldering of microcontrollers. Antimony is also extremely toxic in the gaseous state and should therefore only be used with good ventilation. Information on the composition and the group of solder and the proportion of flux are usually printed on the package. If these are not available, the solder should only be used for insensitive components and taking into account all protective measures such as ventilation.

*Last update on 2019-08-28 / Affiliate links(we get a commission when you buy on amazon) / Images from Amazon Product Advertising API